Services
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Foundry Services
Our semiconductor foundry services deliver end-to-end fabrication capabilities optimized for GaN HEMT technology. From custom epitaxial growth to precise frontend modular processing, we provide scalable wafer-level solutions. Beyond our core GaN HEMT platforms, our process expertise and comprehensive tool set allow us to support development in emerging fields like nitride MEMS, quantum technologies and advanced photonics. For more information related to Foundry services.
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Characterization Services
Our comprehensive semiconductor characterization services provide critical in-line process control and post process electrical testing for GaN HEMT and related technologies. We also provide design modeling and TCAD simulation services to validate and optimize device performance. For information related to Characterization services.
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Packaging services
Our packaging services offer back-end processing from custom grinding and dicing across substrate materials to flexible, semi-automated die attachment and advanced wire/ribbon bonding. We deliver reliable assembly solutions customized to your specific geometry and package requirements. For more information related to Packaging services.
