Packaging Services

Our packaging services offer back-end processing from custom grinding and dicing across substrate materials to flexible, semi-automated die attachment and advanced wire/ribbon bonding. We deliver reliable assembly solutions customized to your specific geometry and package requirements.

1. Wafer Grinding

• • We provide custom wafer grinding for Si, SiC, sapphire and glass substrates. We process substrate sizes from 0.5″ to 8″.

2. Dicing

• • We support custom wafer dicing requests based on your device geometry. We can service dicing requests on various substrate types up to 8″ wafer size.

3. Die attach

• • Our semiautomatic die bonder can handle pick and place from wafer or waffle pack to a package or waffle pack. We can support various geometries and adhesives as needed by customer’s process. Customers can choose from our standard die attach processes or request development of custom die attach processes suited to their needs.

4. Wire bonding

• • Customers can use our automatic wire bonder to carry out wire bonding of their semiconductor die. We support both wire and ribbon bonding to various package types (e.g QFN, TO etc.) using Au and Al wires.