Packaging Tools

We offer a comprehensive set of packaging tools to handle wafer thinning, dicing, die attach, wire bonding and final assembly. We also have supporting equipment such as ovens, plasma cleaners, microscopes, wire-pull/die-shear testers etc. to assist adhesion processes and perform mechanical and electrical testing. Together these systems process wafers up to 8″ and mounted assemblies with the handling and verification needed for high-yield packaging.

Grinder

Manufacturer: Disco Hi Tec Grinder_DAG810

Our grinding tool is a compact, automatic grinder (wafer-thinning) that can handle workpieces ≤ 8″ in diameter. It is designed to process a variety of materials, such as Si and SiC wafers.

Dicer

Manufacturer: Disco Hi Tec Dicer_DAD3350

Our ultrasonic-wave dicing machine can handle workpieces ≤ 8’’. It allows the processing of Si and difficult-to-process materials, such as ceramic, glass and SiC and can also handle the alignment of multiple mounted workpieces.

Wire Bonder

Manufacturer: Hesse Mechatronics Wirebonder

Our wire bonder has changeable bond heads, which allow wedge-wedge and ball-wedge bonding of thin, heavy, and ribbon wires.

Automatic Die Bonder

Manufacturer: Tresky Automation Diebonder

Our die bonder can perform adhesive and eutectic die bonding in automatic, semi-automatic, as well as manual modes. The tool allows die picking from wafers (≤ 8″), waffle packs (2” and 4”), and gel packs (2” and 4”).

Packaging Plasma Cleaner

Manufacturer: Diener Electronics Plasma Cleaner

This surface-preparation system removes nanoscale organic contaminants and oxides from substrates prior to assembly and improves adhesion for subsequent wire bonding and encapsulation steps.

Wire Pull and Die Shear Tester

Manufacturer: XYZ TEC Wire Pull & Die Shear

This quality-assurance tool evaluates the mechanical bond strength and interconnection integrity by applying controlled pull and shear forces, ensuring reliability of bonds and die attachments.